src/mainboard/google/zork/spd/hynix-HMAA1GS6CMR6N-VK.spd.hex

# Number of Serial PD Bytes Written / SPD Device Size (SPD Bytes Used : 384 / SPD Bytes Total : 512)
23

# SPD Revision (Rev. 1.1)
11

# Key Byte / DRAM Device Type (DDR4 SDRAM)
0C

# Key Byte / Module Type (nECC SO-DIMM)
03

# SDRAM Density and Banks (2BG/4BK/8Gb)
45

# SDRAM Addressing (16/10)
21

# Primary SDRAM Package Type (DDP)
91

# SDRAM Optional Features (Unlimited MAC)
08

# SDRAM Thermal and Refresh Options (Reserved)
00

# Other SDRAM Optional Features (PPR) (hPPR, sPPR supported)
60

# Secondary SDRAM Package Type
00

# Module Nominal Volatage, VDD (1.2V)
03

# Module Organization (1Rx8)
01

# Module Memory Bus Width (LP/x64)
03

# Module Thermal Sensor (Termal sensor not incorporated)
00

# Extended Module Type (Reserved)
00

# Reserved
00

# Timebases (MTB : 125ps, FTB : 1ps)
00

# SDRAM Minimum Cycle Time (tCKAVGmin) (0.75ns)
06

# SDRAM Maximum Cycle Time (tCKAVGmax) (1.6ns)
0D

# CAS Latencies Supported, First Byte (10, 11, 12, 13, 14)
F8

# CAS Latencies Supported, Second Byte (15, 16, 17, 18, 19, 20)
3F

# CAS Latencies Supported, Third Byte
00

# CAS Latencies Supported, Fourth Byte
00

# Minimum CAS Latency Time (tAAmin) (13.75ns)
6E

# Minimum RAS to CAS Delay Time (tRCDmin) (13.75ns)
6E

# Minimum RAS to CAS Delay Time (tRPmin) (13.75ns)
6E

# Upper Nibbles for tRASmin and tRCmin (32ns / 45.75ns)
11

# tRASmin, Least Significant Byte (32ns)
00

# tRCmin, Least Significant Byte (45.75ns)
6E

# tRFC1min, LSB (350ns)
F0

# tRFC1min, MSB (350ns)
0A

# tRFC2min, LSB (260ns)
20

# tRFC2min, MSB (260ns)
08

# tRFC4min, LSB (160ns)
00

# tRFC4min, MSB (160ns)
05

# Upper Nibble for tFAW (30ns)
00

# tFAWmin LSB (30ns)
F0

# tRRD_Smin (5.3ns)
2B

# tRRD_L min (6.40ns)
34

# tCCD_Lmin, same bank group (5ns)
28

# tWRmin Upper Nibbles (15ns)
00

# tWRmin (15ns)
78

# tWTRmin Upper Nibbles (2.5ns/7.5ns)
00

# tWTR_Smin (2.5ns)
14

# tWTR_Lmin (7.5ns)
3C

# Reserved
00 00 00 00 00 00 00 00 00 00 00 00 00 00

# Connector to SDRAM Bit Mapping (DQ0-3)
16

# Connector to SDRAM Bit Mapping (DQ4-7)
36

# Connector to SDRAM Bit Mapping (DQ8-11)
0B

# Connector to SDRAM Bit Mapping (DQ12-15)
35

# Connector to SDRAM Bit Mapping (DQ16-19)
16

# Connector to SDRAM Bit Mapping (DQ20-23)
36

# Connector to SDRAM Bit Mapping (DQ24-27)
0B

# Connector to SDRAM Bit Mapping (DQ28-31)
35

# Connector to SDRAM Bit Mapping (CB0-3)
00

# Connector to SDRAM Bit Mapping (CB4-7)
00

# Connector to SDRAM Bit Mapping (DQ32-35)
16

# Connector to SDRAM Bit Mapping (DQ36-39)
36

# Connector to SDRAM Bit Mapping (DQ40-43)
0B

# Connector to SDRAM Bit Mapping (DQ44-47)
35

# Connector to SDRAM Bit Mapping (DQ48-51)
16

# Connector to SDRAM Bit Mapping (DQ52-55)
36

# Connector to SDRAM Bit Mapping (DQ56-59)
0B

# Connector to SDRAM Bit Mapping (DQ60-63)
35

# Reserved
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00

# Fine offset for tCCD_Lmin, same bank group (5ns)
00

# tRRD_L min offset (6.40ns)
9C

# tRRD_Smin offset (5.3ns)
B5

# Fine offset for tRCmin (45.75ns)
00

# Fine offset for tRPmin (13.75ns)
00

# Fine offset for tRCDmin (13.75ns)
00

# Fine offset for tAAmin (13.75ns)
00

# Fine offset for tCKAVGmax (1.6ns)
E7

# Fine offset for tCKAVGmin (0.75ns)
00

# CRC for Base Configuration Section, LSB (CRC cover 0~125 byte)
FD

# CRC for Base Configuration Section, MSB (CRC cover 0~125 byte)
EE

# RC Extention, Module Nominal Height (30.00)
0F

# Module Maximum Thickness (1.0/1.2)
01

# Reference Raw Card Used (ZZ0)
1F

# Address Mapping from Edge Connector to DRAM (Standard)
00

# Reserved
00 00 00 00 00 00 00 00

# Reserved (Must be coded as 0x00)
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

# Reserved
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00

# CRC for Module Specific Section, LSB (CRC cover 128~253 byte)
7D

# CRC for Module Specific Section, MSB (CRC cover 128~253 byte)
21

# Reserved
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00

# Module Manufacturer's ID Code, LSB (SK hynix)
80

# Module Manufacturer's ID Code, MSB (SK hynix)
AD

# Module Manufacturing Location (SK hynix (Icheon))
01

# Module Manufacturing Date (Variable)
00

# Module Manufacturing Date (Variable)
00

# Module Serial Number (Undefined)
00

# Module Serial Number (Undefined)
00

# Module Serial Number (Undefined)
00

# Module Serial Number (Undefined)
00

# Module Part Number (HMAA1GS6CMR6N-VK    )
48 4D 41 41 31 47 53 36 43 4D 52 36 4E 2D 56 4B
20 20 20 20

# Module Revision Code (Revision 0)
00

# DRAM Manufacturer's ID code, LSB (SK hynix)
80

# DRAM Manufacturer's ID code, MSB (SK hynix)
AD

# DRAM Stepping (Undefined)
FF

# Module Manufacturer's Specific Data
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 DD

# Reserved
00 00

# End User Programmable
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00
00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00