| # Generic DDR4 SPD template |
| # Fields that are not required should be set to zero |
| # CRC will be calculated when generating SPDs from this template, so no need |
| # to update here |
| |
| # Number of Serial PD Bytes Written / SPD Device Size (SPD Bytes Used : 384 / SPD Bytes Total : 512) |
| 23 |
| |
| # SPD Revision (Rev. 1.1) |
| 11 |
| |
| # Key Byte / DRAM Device Type (DDR4 SDRAM) |
| 0C |
| |
| # Key Byte / Module Type (nECC SO-DIMM) |
| 03 |
| |
| # SDRAM Density and Banks (2BG/4BK/8Gb) |
| 45 |
| |
| # SDRAM Addressing (16/10) |
| 21 |
| |
| # Primary SDRAM Package Type (Flipchip SDP) |
| 00 |
| |
| # SDRAM Optional Features (Unlimited MAC) |
| 08 |
| |
| # SDRAM Thermal and Refresh Options (Reserved) |
| 00 |
| |
| # Other SDRAM Optional Features (PPR) (hPPR, sPPR supported) |
| 60 |
| |
| # Secondary SDRAM Package Type |
| 00 |
| |
| # Module Nominal Volatage, VDD (1.2V) |
| 03 |
| |
| # Module Organization |
| 01 |
| |
| # Module Memory Bus Width (LP/x64) |
| 03 |
| |
| # Module Thermal Sensor (Termal sensor not incorporated) |
| 00 |
| |
| # Extended Module Type (Reserved) |
| 00 |
| |
| # Reserved |
| 00 |
| |
| # Timebases (MTB : 125ps, FTB : 1ps) |
| 00 |
| |
| # SDRAM Minimum Cycle Time (tCKAVGmin) (0.75ns) |
| 06 |
| |
| # SDRAM Maximum Cycle Time (tCKAVGmax) (1.6ns) |
| 0D |
| |
| # CAS Latencies Supported, First Byte (10, 11, 12, 13, 14) |
| F8 |
| |
| # CAS Latencies Supported, Second Byte (15, 16, 17, 18, 19, 20) |
| 3F |
| |
| # CAS Latencies Supported, Third Byte |
| 00 |
| |
| # CAS Latencies Supported, Fourth Byte |
| 00 |
| |
| # Minimum CAS Latency Time (tAAmin) (13.75ns) |
| 6E |
| |
| # Minimum RAS to CAS Delay Time (tRCDmin) (13.75ns) |
| 6E |
| |
| # Minimum RAS to CAS Delay Time (tRPmin) (13.75ns) |
| 6E |
| |
| # Upper Nibbles for tRASmin and tRCmin (32ns / 45.75ns) |
| 11 |
| |
| # tRASmin, Least Significant Byte (32ns) |
| 00 |
| |
| # tRCmin, Least Significant Byte (45.75ns) |
| 6E |
| |
| # tRFC1min, LSB (350ns) |
| F0 |
| |
| # tRFC1min, MSB (350ns) |
| 0A |
| |
| # tRFC2min, LSB (260ns) |
| 20 |
| |
| # tRFC2min, MSB (260ns) |
| 08 |
| |
| # tRFC4min, LSB (160ns) |
| 00 |
| |
| # tRFC4min, MSB (160ns) |
| 05 |
| |
| # Upper Nibble for tFAW (30ns) |
| 00 |
| |
| # tFAWmin LSB (30ns) |
| F0 |
| |
| # tRRD_Smin (5.3ns) |
| 2B |
| |
| # tRRD_L min (6.40ns) |
| 34 |
| |
| # tCCD_Lmin, same bank group (5ns) |
| 28 |
| |
| # tWRmin Upper Nibbles (15ns) |
| 00 |
| |
| # tWRmin (15ns) |
| 78 |
| |
| # tWTRmin Upper Nibbles (2.5ns/7.5ns) |
| 00 |
| |
| # tWTR_Smin (2.5ns) |
| 14 |
| |
| # tWTR_Lmin (7.5ns) |
| 3C |
| |
| # Reserved |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ0-3) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ4-7) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ8-11) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ12-15) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ16-19) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ20-23) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ24-27) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ28-31) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (CB0-3) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (CB4-7) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ32-35) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ36-39) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ40-43) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ44-47) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ48-51) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ52-55) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ56-59) |
| 00 |
| |
| # Connector to SDRAM Bit Mapping (DQ60-63) |
| 00 |
| |
| # Reserved |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 |
| |
| # Fine offset for tCCD_Lmin, same bank group (5ns) |
| 00 |
| |
| # tRRD_L min offset (6.40ns) |
| 9C |
| |
| # tRRD_Smin offset (blank) |
| 00 |
| |
| # Fine offset for tRCmin (45.75ns) |
| 00 |
| |
| # Fine offset for tRPmin (13.75ns) |
| 00 |
| |
| # Fine offset for tRCDmin (13.75ns) |
| 00 |
| |
| # Fine offset for tAAmin (13.75ns) |
| 00 |
| |
| # Fine offset for tCKAVGmax (1.6ns) |
| E7 |
| |
| # Fine offset for tCKAVGmin (0.75ns) |
| 00 |
| |
| # CRC for Base Configuration Section, LSB (CRC cover 0~125 byte) |
| 00 |
| |
| # CRC for Base Configuration Section, MSB (CRC cover 0~125 byte) |
| 00 |
| |
| # RC Extension, Module Nominal Height |
| 00 |
| |
| # Module Maximum Thickness |
| 00 |
| |
| # Reference Raw Card Used |
| 00 |
| |
| # Address Mapping from Edge Connector to DRAM (Standard) |
| 00 |
| |
| # Reserved |
| 00 00 00 00 00 00 00 00 |
| |
| # Reserved (Must be coded as 0x00) |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| |
| # Reserved |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 |
| |
| # CRC for Module Specific Section, LSB (CRC cover 128~253 byte) |
| 00 |
| |
| # CRC for Module Specific Section, MSB (CRC cover 128~253 byte) |
| 00 |
| |
| # Reserved |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| |
| # Module Manufacturer's ID Code, LSB (blank) |
| 00 |
| |
| # Module Manufacturer's ID Code, MSB (blank) |
| 00 |
| |
| # Module Manufacturing Location (blank) |
| 00 |
| |
| # Module Manufacturing Date (Variable) |
| 00 |
| |
| # Module Manufacturing Date (Variable) |
| 00 |
| |
| # Module Serial Number (Undefined) |
| 00 |
| |
| # Module Serial Number (Undefined) |
| 00 |
| |
| # Module Serial Number (Undefined) |
| 00 |
| |
| # Module Serial Number (Undefined) |
| 00 |
| |
| # Module Part Number (blank) |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 |
| |
| # Module Revision Code (Revision 0) |
| 00 |
| |
| # DRAM Manufacturer's ID code, LSB (blank) |
| 00 |
| |
| # DRAM Manufacturer's ID code, MSB (blank) |
| 00 |
| |
| # DRAM Stepping (Undefined) |
| 00 |
| |
| # Module Manufacturer's Specific Data (blank) |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| |
| # Reserved |
| 00 00 |
| |
| # End User Programmable |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |
| 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 00 |